DynaFlex II Go – Device Inspection

The MagTek DynaFlex II Go is a secure card reader authenticator in a compact form factor, designed to support a wide range of payment methods, including NFC contactless, EMV contact chip, and magnetic stripe transactions. It connects via USB-C or Bluetooth® Low Energy (LE), making it suitable for both countertop and mobile payment environments.

This guide outlines how to inspect your DynaFlex II Go device for signs of tampering, explains its components, and details compliance and certification requirements.

Physical Inspection Checklist

Merchants should regularly inspect their DynaFlex II Go devices to ensure they have not been altered or tampered with.

Overall Form Factor

• The device has a smooth outer shell with molded seams between the top and bottom.

• There should be no breaks in the plastic, added wires, or changes in size or weight.

• Dimensions: 2.76 in. × 2.57 in. × 0.79 in. (70.1 mm × 65.3 mm × 20.1 mm)

• Weight: 92 g (with BCR & Bluetooth LE) or 90 g (with Bluetooth LE).

Top of Device

• EMV chip slot – smooth path with only chip contact points.

• Magstripe reader slot – smooth swipe path with a single spring-mounted read head.

• Contactless landing zone – flat surface with no moving parts, marked by the contactless symbol.

Front Face

• Directional icons clearly indicate where to tap, dip, or swipe.

• LED indicators (x4) provide status feedback (see operation manual for details).

• Barcode Reader (BCR models only) – includes a QR code icon and directional arrow.
  

Bottom of Device

• USB-C receptacle used for power and charging.

• Ensure no additional or extraneous cables are attached.

Right Side

• Contains a single tactile pushbutton.

• No other components should be present.

Back of Device

• Contains the product label with serial number, part number, hardware ID, and manufacturing date.

• Imprints of certification logos and patent details.

⚠️ Tamper Detection:
If the device experiences forced entry, built-in security switches will automatically clear sensitive data, including encryption keys and certificates, rendering the device inoperable. Such devices must be returned via RMA (Return Material Authorization) and cannot be repaired in the field.

PCI Device Validation

To verify PCI compliance:

1. Check the Hardware ID printed on the product label.

2. Access the Firmware ID from the device.

3. Cross-check both values with the PCI listing for MagTek DynaFlex II Go at:
   ? PCI Security Standards – Approved Devices

As part of inspection audits, merchants should:

• Keep a list of all deployed devices.

• Record details from the product label.

• Take photos of the device (front, back, and sides).

• Confirm part numbers, serial numbers, and IDs.
  
  

Compliance Certifications

The DynaFlex II Go meets the following compliance standards:

• FCC: Complies with Part 15 for Class B devices.

• Canadian ICES-003: Meets Class B limits for digital apparatus.

• Industry Canada (IC) RSS: Licence-exempt compliance.

• UL / cUR: Recognized under Underwriters Laboratories standards.

• CE: Certified for European safety, health, and environmental requirements.

• EU Directive 2014/53/EU: Wireless and contactless compliance.

• UKCA: Complies with UK Radio Equipment Regulations 2017.

• RoHS: Available in a lead-free, environmentally compliant configuration.

• PCI PTS Approval: Approved under PCI’s PIN Transaction Security standards.

Best Practices for Device Security

• Conduct regular physical inspections using the checklist above.

• Verify PCI compliance status annually.

• Report any signs of tampering immediately and follow RMA procedures if needed.

• Maintain accurate records of device deployment, including photos, serial numbers, and inspection logs.